How To Order Optional Add-On Packages

JasperGold Formal Verification Platform Option to the IC Package

The JasperGold formal verification platform is comprised of a range of formal verification apps which incorporate machine learning to improve verification productivity.

The Europractice Optional Package includes:

3DIC Option to both Systems and IC packages

The 3DIC option provides tools to enable advanced 2.5D,3D, chiplet and hetereogenous IC system design. This includes Integrity, a tool focused on 3DIC designs helping ease the process of combing multiple chips together in heterogeneously integrated designs. Integrity includes many system planning, floorplanning, interposer design, IO planning, system analysis and system verification features to expedite the design flow of this type of design. The Voltus 3D option is also included, enabling power integrity analysis for 3DIC designs.

The Europractice Optional Package includes:

Stratus High Level Synthesis Option to the IC package

With Stratus HLS, you can quickly design and verify high-quality RTL implementations from abstract IEEE 1666 synthesisable SystemC, C, or C++ models. The models can be easily created using the Stratus integrated design environment (IDE).

With Stratus HLS, SystemC models can be retargeted to new technology platforms and reused more easily than traditional hand-coded RTL.

The Europractice Optional Package includes:

Legato Reliability Solution Option to the IC package

The Cadence® Legato™ Reliability Solution provides analogue designers with the tools they need to manage their design’s relia bility throughout the product lifecycle. Responding to the challenges of designing for mission-critical applications such as automotive, aerospace, and medical design, the Legato Reliability Solution includes new technology to simulate the manufacturing test’s ability to identify and eliminate de fective parts, the effect of temperature on circuit electrical performance, and changes in devices over time including the effects of temperature and p rocess variation on aging.

The Europractice Optional Package includes:

System in Package Option to both Systems and IC packages

The SiP Option additionally provides Digital and RF SiP design capabilities, streamlining the integration of multiple chips (into a die stack or single substrate). It includes tools for architecting SiP systems by capturing and exploring top-level SiP connectivity, IC/package IO planning and optimisation for 3D die stack creation, 3D die stack viewing, DRC, bondability verification, and cross-die RF SiP simulation.

The Europractice Optional Package includes:

IC Advanced Node Option to the IC Package

This Europractice option includes the Advanced Node version of the Virtuoso and Innovus platforms. This additional functionality is necessary for custom design at 20nm and below or digital design at 10nm and below. It is complemented by the Quantus advanced node extraction capabilities found in the IC Package. The advanced node capabilities of this version of Virtuoso are also required for some 28nm and 22nm FDSOI design kits.

The Europractice Optional Package includes:

Virtual System Platform (VSP) Option to the IC package

The Virtual System Platform Option includes Helium Virtual and Hybrid studio which allows the development of Virtual Platforms. Virtual Platforms enable pre-RTL software development, functional verification, and system analysis and optimization before committing to hardware micro-architecture. VSP automates the process of creating a virtual prototype, debugging software with a virtual prototype, and deploying the virtual prototype to the software team.

Virtual Platforms can also be used after RTL/Silicon is available. The Virtual Platform allows greater visibility than a hard ware prototype, allowing better debug and verification of internal blocks and signals, and offers much greater performance than RTL simulation, allowing interactive debugging of software applications running on t he Virtual platform.

The Europractice Optional Package includes:

VSP requires 3rd party processor models from Imperas (OVP models - support for ARM, ARC, MIPS, etc.). Imperas models are included in the VSP installation, however, a license for Imperas must be obtained separately before VSP can be used. Licenses for Imperas are available through EUROPRACTICE.

For further information on processor models, and how to order, please see our Imperas Pages

Liberate AMS Mixed Signal and Memory Characterisation Option to the IC Package

Liberate AMS enables the timing characterisation of mixed signal blocks to be used in a digital-centric mixed signal flow. Liberate MX supports the characterisation of custom and generated memory instances. Liberate AMS and Liberate MX are available to Europractice users on request and at Cadence's approval.
The well established tools Liberate, Liberate Variety and Liberate LV for library characterisation and validation are available as part of the core IC pacakge.

The Europractice Optional Package includes:

All potential users interested in using Liberate AMS or Liberate MX should contact the Microelectronics Support Centre via MicroelectronicsCentre@stfc.ac.uk for further information.