Integrated photonics is revolutionising a wide range of applications in communications, data processing, sensing, and quantum technologies. As photonic devices become increasingly complex and move towards large-scale deployment, advanced packaging is critical to meeting growing demands for high performance, power efficiency, reliability, and low cost.

This webinar will introduce the fundamental challenges of photonic packaging and explain the basic requirements for optical coupling, alignment, electrical connectivity, and mechanical robustness, while contrasting how these requirements differ from those of conventional electronic packaging. We will further outline the photonics packaging and heterogeneous integration services and capabilities available through Europractice. Finally, we will present an outlook on emerging trends such as co-packaged optics and highly integrated photonic-electronic systems and discuss routes towards scalable photonics packaging and integration.