Micro transfer printing (µTP) is a key technology for heterogeneous integration, enabling precise placement of devices on various substrates. It combines materials with different processing needs, achieving high accuracy and scalability.

This webinar covers µTP principles, factors affecting yield and reliability, and highlights Tyndall National Institute’s recent advancements in III-V integration and photonic device assembly, emphasising its support for the Europractice wafer services for the research and industrial community.