This course aims to guide attendees through the fabrication of a simple light-emitting device and help them develop a solid grasp of the technology involved.

Overview of the technological steps involved in fabrication and testing of semiconductor devices through the realisation of red-emitting lasers on a GaAs substrate. Attendees will be familiarized with the state-of-the-art fabrication facilities and equipment available in Tyndall National Institute. Through observation of the processes involved, attendees will learn how to safely undertake the process steps involved in fabrication.?Main fabrication processes such as photolithography, wet and dry etch, chemical vapour deposition (CVD), metallization will be introduced as well as the materials used for fabricating photonic devices. This course also includes laboratory sessions on substrate handling, lift-off lithography, substrate thinning, device cleaving to form facets and basic testing of the completed devices.

At the end of the course attendees should be able to:

• Demonstrate knowledge of sub-technologies such as; photolithography, etching, metal deposition, thermal treatments and measurement that form the full compound semiconductor device fabrication process.
• Demonstrate knowledge of the relationship between materials used, process techniques and how these two factors are used to fabricate devices such as semiconductor lasers.
• Test a simple device and understand the relationship between process parameters and device characteristics.
• Recognise the differences, but also see the similarities, between silicon IC fabrication and compound semiconductor device fabrication.
• Fabricate a simple light emitting device and understand the technology involved.

Course details:

• Introduction, orientation and Europractice Overview (lecture)
• Lab safety outline (lab)
• IIIV material sample handling (lab)
• Process steps carried out by instructor only (lab)
  • Lithography – patterning for etching and for lift-off
  • Etching – wet / dry
  • Metal deposition – ebeam evaporation
  • Chemical Vapour Deposition
  • Annealing
  • Measurement techniques: profiling, interferometry
  • Wafer thinning
  • Facet cleaving
  • Basic device testing to confirm operation
• Lectures (x7), basics of:
  • Lithography
  • Deposition
  • Etching
  • Metallisation
  • Metrology
  • Laser theory
  • Mask design

A fundamental grasp of semiconductor technology is recommended but not obligatory.