SoftMEMS are offering EUROPRACTICE members a free 30-day evaluation license of their PC MEMS Pro product. If you wish to take advantage of this offer, please contact the Microelectronics Support Centre at RAL.
Email: MicroelectronicsCentre@stfc.ac.uk
PC Based MEMS Pro
Please note. PC MEMS Pro is a MEMS overlay to Tanner tools. MEMS Pro from SoftMEMS does not include Tanner tools and this must be purchased separately (available through EUROPRACTICE).
MEMS Pro is a PC-based integrated CAD tool suite for the design of microsystems coupled with electronics. It ensures a seamless design flow from schematic capture to system simulation and to automated or custom layout and verification. MEMS Pro designs are foundry-ready with industry-standard output formats including GDS II, CIF, EDIF and DXF. MEMS Pro is an easy to use product and is the right choice for first-time CAD tool users.
MEMS Pro is based on 2 modules:
Modules
Description
Tools Required
MEMS Pro DS (Design Suite)
Complete design environment dedicated to MEMS from schematic simulation to mask layout design - Ensure the link between layout and 3-dimensional model.
Tanner L-Edit v15.02
Tanner T-Spice Pro v15.02
ROM
Reduced order model generator.
ANSYS v9.0 to v13.0
MEMS Pro Features:
Enable the creation of multi-domain schematics using mechanical, electrical, thermal, optical and fluidic signals.
Permit simulation of systems containing MEMS and electronic devices with MEMS components represented as equivalent circuits, behavioural models or tables of data.
Contain MEMS-specific drawing features such as an all-angle mask layout capability, advanced geometry primitives (including arcs and torii) and a cross-section viewer which illustrates the fabrication steps.
Check design rules including the special needs of MEMS designers for curvilinear geometry and function-specific rules.
Support MEMS and IC device layout extraction. The multi-domain connectivity is extracted in both schematic and layout allowing a layout vs. schematic (LVS) check.
Verification environment includes a 3D solid modeler, and direct links to Finite Element and Boundary Element tools such as ANSYS.
Include a powerful User Programmable Interface for automating, customising and extending MEMS Pro’s command set.
Technology support for MEMS libraries includes component schematics, behavioral models, and automated parameterised layout generators as well as design rules, extraction rules, technology-layer and process descriptions.
Support popular fabrication processes. Users may also describe their own technology using the convenient process description editor that supports surface and bulk micromachining steps such as deposit, etch, etc.
ROM Features
Generate a behavioral model written in Spice that can be simulated in T-Spice from Tanner reducing a finite element model provided from ANSYS to a few degrees of freedom.
Handle single or multi physics applications such as mechanical or coupled electro-mechanical structures.
The MEMSCAP design kit allows users to customise the MEMS Xplorer and MEMS Pro engineering platforms for designs targeted at the 3 MUMPs' technologies:
PolyMUMPs: surface micro-machining, three levels of polysilicon and one level of metal.
SoiMUMPs: on SOI wafers, DRIE step to etch the thick epitaxial layer on top of the silicon dioxide. Silicon dioxide is then removed as a sacrificial layer. Anisotropic bulk etch on the substrate back side is possible.
MetalMUMPs: LIGA UV technology to get metal parts as thick as 30um.Very high aspect ratio achieved.
Please refer to MEMSCAP web site for more details on the MUMPs technologies: MEMSCAP web site
MEMSCAP will also make available a design kit for a large range of foundries on request such as:
MOSIS
ADI (Analog Devices)
Design Kit Features:
Technology specific parameterised component libraries in the form of standard cells described at different abstraction levels (symbolic, behavioural, and parameterised layout).
Geometric process descriptions, design rules, and extraction rules.
High-level macros to assist in layout drawing: technology specific object creation, and automation of typical tasks such as release of polysilicon plates.
The EUROPRACTICE IC Service offers MPW runs in the PolyMUMPs, SoiMUMPs and MetalMUMPs processes. For more information please refer to the IMEC web site: IMEC website