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|IntelliSuite Comprehensive||BioMEMS and Microfluidics Option||How to Order|
Evaluation LicensesIntelliSense are offering Europractice members a free 30-day evaluation license of their products. This will allow new users to evaluate any IntelliSense product and existing users to evaluate additional products. If you wish to take advantage of this offer, please contact the Microelectronics Support Centre at RAL.
|IntelliSuite 8.7 Brochure (6 MB)||IntelliSuite Design Flow|
BioMEMS and Microfluidics Option
|The BioMEMS and Microfluidics Option provides additional functionality to either the IntelliSuite Comprehensive or the IntelliSuite Plus products.|
|The Microfluidics analysis module is a full 3D Navier-Stokes solver optimised for microfluidic applications. Support has been included for electrokinetic phenomena, Red-Ox reactions, acids, bases, ampholytes and fluid structure interaction.|
|Advanced visualisation algorithms allow the designer to look at cross-sectional profiles, velocity vectors and transient results. Using the Microfluidics analysis module the designer can investigate:|
|The technical brochure below, in Adobe Acrobat format, provides further information on the IntelliSense BioMEMS and Microfluidics analysis system.|
|BioMEMS and Microfluidics analysis datasheet|
|SYNPLE allows you to capture your MEMS at a schematic level. Your design can then be quickly iterated and optimized at different granularities. Sophisticated synthesis algorithms can automatically convert your schematic into mask layout, 3D or better yet a meshed structure for full multiphysics analysis.|
|SYNPLE includes state-of-the-art schematic capture and simulation tools allowing you to take a hierarchical approach to the design space. SYNPLE provides a large multi-domain library of electrical, mechanical, thermal, and MEMS libraries. These elements may be combined in an effortless drag-and-drop fashion and then wired to create schematics of multi-domain systems. As a result, you can quickly survey a large design space before initiating a detailed analysis and verification process.|
|Users can perform device-level optimization using Design of Experiments (DoE), Robust Design or other techniques. Built-in place-and-route and synthesis algorithms can be then used to convert the schematic into a mask layout or an optimally hexahedral meshed model ready for full 3D analysis.|
How to Order
Orders are placed with the vendor on a single order, once per month. To be included in the current month's order, all documents including original ink-signed paper End User Agreements (if applicable) must be received by the Microelectronics Support Centre no later than the 25th day of the month.
Detailed instructions on how to place an order are given in our Order Procedures.
MANDATORY DOCUMENTS FOR ALL ORDERS
- IntelliSense Order Form (login required) 1 copy, electronic copy via e-mail accepted, and
- Purchase Order 1 copy, electronic copy via e-mail accepted
MANDATORY DOCUMENTS FOR FIRST TIME ORDER FROM THIS VENDOR ONLY
- IntelliSense End User Agreement for Academic Institutes TWO copies each with signatures in ink, electronic copies NOT accepted, paper originals must be sent to the Microelectronics Support Centre via courier recommended, see Order form for address, or
- IntelliSense End User Agreement for Research Laboratories Instructions as per Agreement for Academic Institutes
STATEMENT FROM RESEARCH LABORATORIES
- End Usage Statement for Vendor Approval required when ordering first licenses of any new license bundle, 1 copy, electronic copy via e-mail accepted, can be sent in advance of other paperwork
PLEASE ENSURE that you read the End User Agreement Notes before downloading the End User Agreements
- Software price list (login required)
- Maintenance price list (login required)
- Software Versions and Operating Systems
|The EUROPRACTICE Software Service is managed by the Microelectronics Support Centre, STFC Rutherford Appleton Laboratory, UK.
You can contact the Microelectronics Support Centre by email: MicroelectronicsCentre@stfc.ac.uk
Last modified: March 28, 2017