Highlights

• Full 64-bit mode throughout CoventorWare workflow, for Windows and Red Hat Enterprise Linux 64-bit operating systems. In previous releases, only the MemMech solver ran in 64-bit mode on 64-bit operating systems; all other modules ran in 32-bit mode. With the 2012 release, all frequently used modules will run on 64-bit mode on 64-bit operating systems.
  
  
• A hex-dominant mesher is now included in the Preprocessor. For many typical MEMS geometries, hex-dominant meshes can be much more efficient (smaller mesh for the same accuracy) than pure hex or pure tet meshes.
  
  
• Updated user interface for all Analyzer functionality. The window formerly known as the Database Browser has been extended to become the CoventorWare Console. The Console provides a single convenient window that displays all information needed to create and manage MEMS simulations, including the database, job queue, log window and new scripting console.
  
  
• Analyzer:
  • MemMech harmonic analysis improvements, including the ability to run with electrostatic elements, a harmonic angular acceleration boundary condition, and new anchor loss energy results.
    
    
  • New MemMech contact simulation capabilities now include a general contact boundary condition that eliminates the requirement to specify in advance which faces will contact, and the ability to include suppressed parts in general contact simulations.
    
    
  • CoSolveEM and HarmonicEM now have tabbed interfaces and more boundary condition dialogs that allow the user to configure MemElectro and MemMech from within the CoSolveEM or HarmonicEM interface.
    
    

News.   SEMulator3D 2012 now available through Europractice
SEMulator3D 2012 is a major release and includes new functionality and significant performance improvements.

Highlights

• The SEMulator3D Manager, the Layout Editor, the Modeling Engine, the mesh generation steps, and the 3-D Viewer all run as 64-bit processes on supported 64-bit operating systems. This 64-bit capability enables much larger model builds, with maximum model size limited only by the available computer memory.
  
  
• Skirting operations to protect the sides of the wafer during conformal operations are no longer necessary. The modeling engine automatically handles all wafer boundary issues without user intervention; the software always treats the wafer as it would if it were a smaller section of a larger wafer. Several process steps have been modified to incorporate this new function, and improved handling of wafer boundaries increases model build speed in many cases.
  
  
• Viewer rendering speed has been greatly improved through the use of a new data file and associated algorithm (the material tree). Performance increases are at least 3-4x over the previous release.
  
  
• Large assembly (.zam) files are no longer written out as a sequence of smaller files, and even very large model builds should result in a single .zam file. The Viewer now loads data files as needed when the user steps through the process sequence, and releases memory as needed to respect a userconfigurable memory cap. This incremental loading behavior allows viewing of very large assembly files on both 64- and 32-bit platforms.
  
  
• The cross-section window in the Viewer has been overhauled. Users can click on a specific location on the 3D model to set the cross-section location, and there are new input fields for X,Y position of the cross-section "centroid", which makes it easier to choose a point through which the cross-section should go. Visual appearance of the cross-section locator window has also been improved.
  
  
• Users can add their own watermark to their SEMulator3D assembly files and SEM3D files.
  
  
• Users can close Manager without stopping model build, freeing up the Manager license for other users.

News.   MEMS+ 2.0 now available through Europractice MEMS+ 2.0 provides a standard methodology for modeling MEMS devices and simulating them together with control electronics within Cadence Virtuoso (part of the Cadence IC package). MEMS+ provides MEMS and IC designers with a common platform for MEMS+IC design, MEMS+IC simulation, and MEMS+IC product development. MEMS+ 2.0 comes with an extensive library of 3D MEMS building blocks to enable a wide variety of MEMS-based applications with new enhancements for designing and simulating the flexible structures that occur in inertial sensors, microphones and energy harvesting devices. Additional features in the tool's user interface improve the ease of design creation and re-use. Features in MEMS+ 2.0 Model library enhancements for more MEMS applications Multiple usability enhancements to streamline work flow New 2D graphing tool for result plotting in Scene3D Cadence integration enhancements Much faster simulation (10X speedup vs. MEMS+ 1.0) Support for 64-bit Cadence Spectre/Ultrasim simulations Support for simulation with Spectre RF Support for MATLAB Simulink versions R2009b through R2010b Windows 7 is a new supported platform

3-D MEMS+ model of an accelerometer constructed from MEMS+ model library elements.

MEMS+ 2.0 is available now on Windows 32 and 64 bit OS as well as Linux. The latest release of MEMS+ improves simulation speed in the Cadence Spectre and UltraSim simulators by up to 10x, and now supports simulations in the 64-bit versions of those simulators as well as the 32-bit versions.

News.   CoventorWare evaluation licenses
Coventor are offering EUROPRACTICE members a free 30-day evaluation license of their products. This will allow new users to evaluate any Coventor product and existing users to evaluate additional products. If you wish to take advantage of this offer, please contact the EUROPRACTICE Software Service at RAL.
Email:   MicroelectronicsCentre@stfc.ac.uk

CoventorWare

CoventorWare is a fully integrated MEMS design environment. Using the CoventorWare tools, you can create and simulate a MEMS device rapidly using parametric behavioural models. After converging on a design, CoventorWare's analysis tools provide intensive physical evaluation of critical areas of the device at the Finite Element level. The CoventorWare environment consists of several bundles that can be purchased separately, or together to provide a complete MEMS design environment:

MEMS+

-	Innovator	3-D MEMS Model Schematic Editor
-	MEMS Model Library	Library of behavioral model building blocks
-	Layout P-Cell generator	Automated MEMS layout PCells
-	Scene3D	MEMS Simulation result animation

MEMS+ can be purchased through Europractice as two separate products:

1. Frontend tools (above) with the MEMS+ Library for Cadence simulation
2. Frontend tools (above) with the MEMS+ Library for Matlab simulation

MEMS+ works in conjunction with Cadence Virtuoso (part of the Cadence IC package) to enable simulation of a MEMS and IC together in the Cadence environment. MEMS+ has been integrated with MATLAB Simulink versions R2009b through R2010b (not currently part of the Europractice portfolio), allowing true system level design and analysis and a common MEMS model across the entire design process. MEMS+ is also compatible with existing MEMS design methodologies based on Solid Modeling and Finite Element Analysis.

In MEMS+, the MEMS engineer assembles a design in Innovator, by selecting and combining MEMS model components (building blocks) from the MEMS Model Library. Each library component has a 3D view as well as a sophisticated, accurate behavioral model. When the design is complete, MEMS+ can automatically generate a parametric layout cell (P-Cell) a schematic symbol and a simulation model. The MEMS or IC engineer places the schematic symbol of the MEMS device in an IC schematic and runs simulations in an Analog Mixed Signal (AMS) simulator such as Cadence Spectre. The MEMS engineer can then visualize and animate the simulated MEMS device behavior in Scene3D. Features in MEMS+ A natural 3D interface for design entry Coventor's proven library of accurate MEMS behavioral models Custom parameterization of all design aspects including material properties, process and geometry Interactive or script driven design entry Automatic generation of accurate behavioral models for Cadence Fast simulations of complex, real-world MEMS and MEMS+IC Automatic P-Cell generation
	3-D MEMS+ model of an accelerometer constructed from MEMS+ model library elements.

MEMS+ Datasheet

DESIGNER

DESIGNER is not sold separately, it is part of the ANALYZER bundle. DESIGNER is a front-end tools for the design of Micro-Electro-Mechanical System (MEMS) systems and can be used to create MEMS designs in a variety of ways. The Coventor integrated 2D layout editor, is a powerful and easy to use MEMS layout tool supporting a range of comprehensive drawing and viewing functions.

3D model and mesh export to ANSYS
3D models and meshes that have been automatically created in DESIGNER can be exported directly into ANSYS.

3D ANSYS simulation result import
3D ANSYS simulation results can be imported into the CoventorWare database. This is used for combining package simulation results (from ANSYS) with ARCHITECT3D MEMS device simulations.

Other import and export functions allow exchange of 3D solid model files to third party tools such as EDS PLM Solutions I-DEAS. Models meshed in I-DEAS can be imported back into DESIGNER. DESIGNER can import and export in the following formats:

	Import	Export
2D	GDSII, CIF, DXF	SAT, IGES
3D	UNV, STL, SAT, IGES, STEP, 3D-ProEngineer(*.prt,*.asm), ANSYS Prep 7 and Results (*.ans,*.rst), Patran Neutral (*.pat)	SAT, STL, STEP, IGES, ANSYS Prep 7(*.ans)

Once the mask layers have been defined, the DESIGNER process editor allows users to create process sequences, simulating the foundry process that will fabricate the MEMS design. Materials declared in the process flow can be entered into a Materials Property Database, which stores all the parameters needed to fully characterise the materials of choice.

The solid modeling software produces a 3D solid model of a MEMS device by applying the process description to a 2-D layout. The Preprocessor is an interactive module that enables users to view and edit solid models, generate meshes, view meshes, and do mesh quality checks and prepare the model for Finite Element Analysis.

DESIGNER comprises the following modules:

2D Layout Editor Process Editor Material Property Database 3D Model generation 3D Model Visualizer (Preprocessor) EDS PLM Solutions I-DEAS interface 3D meshing ANSYS model and result translators

DESIGNER. GDSII layout, Visualisation in 3D. Process and Material data. DESIGNER is a powerful tool for both foundries and design houses that lets them communicate templates, design rules and processes.

The technical brochure below, in Adobe Acrobat format, provides further information on the DESIGNER software suite.

ANALYZER

ANALYZER includes the DESIGNER front-end tools plus a comprehensive range of 3D Finite Element and other field solvers, including electrostatic, mechanical, thermal, electromagnetic and coupled solution components. A desired solver or group of solvers is chosen, and a series of windows allow the user to set up file paths, solver configuration parameters, and boundary conditions.

ANALYZER nonlinear mechanical simulation result on a 8-layer MEMS beam showing stress contours The Simulation Manager allows user to create batch run iterations by defining parameters to be varied during the simulation. The solver can iterate variations in model dimensions, material parameters, temperature or voltage values, or a variety of other boundary conditions without altering the original base model. The completed solution set can be graphed or viewed in the 3D Results Visualizer as an animated sequence of events to clearly define trends and variations. Simulation Manager solution values can be extracted using a Query capability to further process the output for use as input by other solvers.

Managed Simulations also can be performed on package models used to house MEMS devices. A complete profile of runs can be created for a package; a boundary condition can be interpolated from the results and applied to a device coupled to the package. The mechanical package solution is linked to the device, which can be analysed for stresses and strains due to boundary conditions imposed on the package.

The solver output for most MEMS models includes a significant amount of data for analysis and post-processing. The solvers include tables of primary result values, along with graphing capability where appropriate. The 3D Results Visualizer tool enables users to map these results graphically onto the original model and analyse the solution.

The new Job Queue has the capability to schedule simulation runs and track progress of the simulations.

ANALYZER comprises the following modules:

2D Layout Editor Process Editor Material Property Database 3D Model generation 3D Model Visualizer (Preprocessor) 3D meshing ANSYS model and result translators EDS PLM Solutions I-DEAS interface 3D Results Visualizer MemElectro, Fast boundary element electrostatic and quasi-electrostatics solver MemMech, Linear and Nonlinear Thermal-mechanics including modal and harmonics analysis, thermal, thermomechanical, electrothermomechanical, electrothermal (joule heating), piezoelectric analyses, and effects of package stresses and strains on a device. MemMech now includes a transient Coupled Electromechanical solver MemPZR, PiezoResistive Mechanical Solver including placement analysis MemHenry, Frequency-dependent resistance and inductance analysis MemDamping, Squeeze film, slide film and free space damping calculations (see MemDamping description under INTEGRATOR) CoSolveEM, Coupled Electromechanical solver

MemHenry Current Density Results

The Electrostatic and Mechanical solvers exploit multiple CPUs and MemMech will run in 64 bit mode on 64 bit computers.

The technical brochure below, in Adobe Acrobat format, provides further information on the ANALYZER software suite.

Application Gallery

MEMS Platform

MEMS Platform is a package of MEMS design tools comprising:

• MEMS+ Frontend tools
• MEMS+ Library for Cadence simulation
• MEMS+ Library for Matlab simulation
• Designer
• Analyzer

Microfluidics

Microfluidics comprises the Bubble-DropSim module providing multi-dimensional (2-D, 3-D, axisymmetric) numerical simulations of two-phase flow with droplet and bubble formation, transport, and impact. It uses the Volume of Fluids (VOF) approach for modeling two-phase flow. The module provides design tools for working on applications and development of drop generation technology, including Drop-on-Demand and continuous jetting, and problems with multiple immiscible liquid phases and suspended particles within a laminar flow.

Listed below are some types of phenomena that can be modeled with Bubble-DropSim:

Drop-on-Demand Nozzle droplet ejection and exit surface wettability Pressure head sensitivity Print head behavior simulation (multi-block simulation enables multi-scale sub-region visibility)	Jetting Continuous inkjet: drop formation including impact of stimulation frequency Droplet electrostatic deflection: droplet selection and steering Gas jet: directional air knife simulating jet movement of liquids on a surface
Contact Printing Gravure offset lithography: image creation and subsequent transfer to receiving substrate Pattern bridging: feature pitch optimization and liquid-liquid coalescence Soft lithography: liquid image transfer	Droplet-Surface Impact Phenomena Three-dimensional feature impact and droplet fragmentation/surface flow Impact, spreading, recoiling, and splashing behavior Inclined surface flow, including droplet coalescence and rivulet formation
Thin Film Coating Dip coating: critical velocity determination for specified liquid-substrate combination Drop casting: dynamics of surface wetting and solidification Porous media: substrate wetting leading to surface coverage effectiveness	Bubble Transport Air bubble flow in a pipe containing liquid Microbubble transport in liquid-filled ducting connecting micro-cells
Chip Cooling Thermal analysis Forced convection, free convection Evaporation/condensation/solidification	Lab-on-a-Chip and Biological Assaying Digital microfluidics, dielectrophoresis (DEP), and electrowetting on dielectric (EWOD) Non-contact droplet transfer onto receiving surface Liquid source pin transfer process simulation

INTEGRATOR

INTEGRATOR is not sold separately, it is part of the ANALYZER bundle. INTEGRATOR reduces the detailed 3D analysis produced in ANALYZER into a reduced-order model that fully characterises the behaviour of the device using a small number of parameters (six degrees of displacement and five degrees of electrical freedom). INTEGRATOR can then export these reduced order models in formats that can be directly used in Synopsys’s Saber or as a text readable format that can be linked back to ANALYZER or other system simulation environments within Matlab-Simulink or Cadence for example.

INTEGRATOR is generally used to let the user create schematic system level models of mechanical and electrostatic-mechanical models that complete the extensive MEMS library components in ARCHITECT3D.

The INTEGRATOR suite comprises the following modules:

SpringMM	-	models flexible structural components such as tethers, linear and non-linear springs. It is also used to model the electrostatic forces between electrodes or combs as electrostatic springs.
DampingMM	-	provides multiple 3D numerical solvers for a wide range of damping effects and geometry types, including: Reynolds solver for squeeze film, Stokes solver for free moving structures and the Full Navier-Stokes solver for all devices.
InertiaMM	-	automatically extracts the inertial coefficients for selected sub-sections of a device that can be modelled as rigid bodies.

The technical brochure below, in Adobe Acrobat format, provides further information on the INTEGRATOR software suite.

INTEGRATOR Datasheet

ARCHITECT3D

ARCHITECT3D includes the INTEGRATOR tools plus a fast and accurate behavioural design and simulation environment combining the Coventor ARCHITECT Libraries and Synopsys Saber. Please note, Saber is part of the Synopsys 'Analogue Simulation & Modelling' bundle and must be purchased separately to ARCHITECT3D. ARCHITECT3D offers a rich set of parameterised MEMS component libraries, a schematic capture engine and a proven simulation engine. Individual libraries support a wide range of MEMS applications, including Electromechanical, Electromagnetic, RF, PZR and Optical. ARCHITECT3D simulation run times are up to 100 times faster than with equivalent 3D Finite Element numerical models, without loosing accuracy.
With ARCHITECT, users can:

Perform "What if" analysis and device optimisation to a degree not achievable with traditional Finite Element numeric solutions. Run many design iterations to identify the process design that optimises manufacturing yields. Accurately design multi-physics MEMS devices and simulate device behaviour. Evaluate multiple aspects of performance, such as transient, packaging, damping, RF and optics to co-design your device and system.

ARCHITECT. From conceptual design and process yield optimisation to MEMS+IC design, ARCHITECT is the software environment for complete MEMS design and manufacturing.

The CoventorWare ARCHITECT3D library contains a comprehensive set of 3D mechanical, electrostatic and damping models used to assemble MEMS devices prior to simulation. Library components are customised with geometry and material property information. Libraries are combined in order to a simulate multi-physics environment for example, by using electromechanical and RF libraries together for switching applications.

Synopsys Saber provides graphical schematic capture to build high-level schematic representations from parameterised MEMS elements or standard component libraries. A schematic-driven layout generator automatically translates geometry information into a 2D GDSII file, then builds the 3D layout within the DESIGNER tool. Simulation capabilities include:

Electrostatic force Mechanical deflection Sensitivity analysis. Transient electromechanical behaviour Frequency response Molecular analysis. Supports device, board and system design 30,000 component library elements 1,000 programmable elements Parameterised MEMS models. Complete simulation environment for analog, digital and mixed technology physics domains Simulates electronics, mechanics, magnetic, thermal, optics and MEMS together in the same environment

Visual representation of the 3-D simulation results from the CoventorWare ARCHITECT system simulator. The video shows the movement of a suspended plate as it is pulled down by a varying voltage and released again. The simulation includes the electrical circuit, transient coupled electrostatic and mechanical physics as well as damping and mechanical contact.

Saber includes a SPICE-like mixed-signal behavioural simulator providing a fast, highly accurate alternative to detailed 3D analysis. Optional manufacturing analysis includes Monte-Carlo and 3 sigma statistical simulation methods. Graphical waveform tools display histograms, scatter grams, AC DC probing, time step and statistical analysis.

Please note. Coventor's ARCHITECT3D and Synopsys Saber are separate products. ARCHITECT3D can be ordered through EUROPRACTICE/Coventor and Saber is ordered through EUROPRACTICE/Synopsys. Please follow the link below for more information on Saber.

• Synopsys Saber mixed-mode simulator

The technical brochures below, in Adobe Acrobat format, provides further information on the ARCHITECT3D products.

ARCHITECT3D Datasheet

ARCHITECT3D presentation

ARCHITECT3D Libraries Datasheet

SEMulator3D

SEMulator3D is ideal for modeling semiconduc as well as MEMS fabrication processes.

Starting from 2D masks in industry-standard GDSII format and a description of the fabrication process. SEMulator3D uses novel "voxel" (volumetric pixel) technology to build high-detailed, realistic-looking virtual prototypes. The voxel technology is robust against mask errors and easily handles a wide range of model scales, all the way from nanometer-scale details through a complete device. SEMulator3D is applicable to all devices that are fabricated with IC-style manufacturing techniques.

Benefits:

Provides realistic looking, highly 3D images of micro-fabricated devices Useful for semiconductor process development, MEMS design, device micro assembly, and mask lithography emulation Customisable to any fabrication process Efficiently handles wide ranges of model sizes from single device to whole wafer Produces realistic virtual prototype models versus ideal geometry models Use Cadence Virtuoso Layout editor to easily build a 3D model from the region of the physical layout that is visible in Virtuoso Semulator3D Manager: Implemented as the central interface, the user can now access, set up, and build 3D models of semiconductor and MEMS designs with complete functionality. The manager ensures compatibility with existing software tools, making it multi-user accessible

SEMulator3D. Process documentation. Process training. Process evaluation. Process integration. Yield enhancement. Failure analysis. For both MEMS and semiconductor processes.

SEMulator3D Datasheet

Kyocera & Hymite Packaging Packaging

CoventorWare 2010 includes Standard Package Libraries from Kyocera as well as Hymite. It contains detailed 2D layouts, prebuilt 3D solid models with preset mesh settings for easy meshing of a wide range of package types. With these pre-constructed models, designers can perform detailed simulations of package impact on MEMS design performance.

The Kyocera Package Library includes popular package types such as PGA (Pin Grid Array), SMD (Surface Mount Device), LCC (Leadless Chip Carrier) etc. plus customizable templates for creating user-specific package variations.

HyCap® is a commercially available proprietary packaging platform by Hymite, based on silicon micromachining. HyCap is designed for increased functionality, streamlined package design, and excellent reliability. HyCap’s target applications are RF and MEMS components for mobile phones, but other applications can benefit from its iniaturization, ease of integration, and advanced performance.

Kyocera Package Libraries

MEMS Design Kits

INTEGRAM MPK, DPK and PPK Process Design Kits

QinetiQ is a Microsystems member of the EUROPRACTICE Foundry Access Program through the INTEGRAM Manufacturing Cluster. QinetiQ offers a silicon-based Micro-Electro-Mechanical Systems (MEMS) prototyping and low volume production service. QinetiQ and Coventor have released three process design kits for use with the CoventorWare design tools. These will make the QinetiQ’s INTEGRAM processes easily accessible to designers with different backgrounds and expertise. The three offered INTEGRAM processes are a Metal-Nitride Surface Micromachining Process (MPK), a DRIE-based SOI Micromachining Process (DPK), and a two level polysilicon sacrificial micromachining process.

The design kits include all CoventorWare design files, such as process files, layout template files, design rule runset files, material property datafiles and example ARCHITECT3D schematic files required to create a design for one of these QinetiQ processes.

The INTEGRAM process design kit files are included the recent release of CoventorWare, are free-of charge and will be automatically shipped with the software. More information regarding the design kits, the process and foundry contact details can be found in the "Using CoventorWare Manual" section 4 called Foundry Design Kits. Additional information on INTEGRAM design case studies and training can be obtained by emailing FoundryProgram@coventor.com

Tronics 60µm SOI-HARM Process Design Kit

TRONIC'S is a Microsystems member of the EUROPRACTICE Foundry Access Program through the MicroBuilder Manufacturing Cluster. TRONIC'S offer an MPW prototyping service for their 60µm SOI-HARM technology. TRONIC'S also offer a ceramic LCC vacuum packaging service targeted at high sensitivity or low noise devices. The SOI one-layer technology is well adapted to training purposes and is ideal for the production of capacitive inertial sensors, electrostatic actuators and resonators.

The design kit includes all CoventorWare design files, such as process file, layout template file, design rule runset file, material property datafile and example ARCHITECT schematic files required to create a design for Tronics 60µm SOI-HARM process.

The Tronics process design kit files included the recent release of CoventorWare, are free-of charge and will be automatically shipped with the software. The process information file is password protected. The password can be obtained from Tronics. More information regarding the design kits, the process and foundry contact details can be found in the "Using CoventorWare Manual" section 4 called Foundry Design Kits. Additional information on Tronics design case studies and training can be obtained by emailing FoundryProgram@coventor.com


The MultiMEMS process design kit files are included the recent release of CoventorWare, are free-of charge and will be automatically shipped with the software. The process information files are password protected. The password can be obtained from Infineon Technologies SensoNor. More information regarding the design kits, the process and foundry contact details can be found in the "Using CoventorWare Manual" section 4 called Foundry Design Kits. Additional information on MultiMEMS design case studies and training can be obtained by emailing FoundryProgram@coventor.com

MUMPS Process Design Kits

MEMSCAP offers a set of three MUMPS MPW processes. PolyMUMPS is a polysilicon / gold surface micromachining process with three structural layers. MetalMUMPS is a thick metal (Nickel) electroplating process. SOIMUMPS features front/backside deep reactive ion etching of SOI.

The related design kits include all CoventorWare design files, such as process files, layout template file, parametric layout generators and material property datafile required to create a design for one of the MUMPS processes.

The MUMPS process design kit files included with the recent release of CoventorWare are free-of charge and will be automatically shipped with the software. More information regarding the design kit, the process and the foundry contact details can be found in CoventorWare DESIGNER reference manual section 4.6 Foundry Processes. Additional information on MUMPS design case studies can be obtained by emailing FoundryProgram@coventor.com

 

Hardware and System Requirements

CoventorWare supported platforms are Windows XP, Windows 7 and Red Hat Enterprise Linux WS 4 and 5.

The CoventorWare Preprocessor and 2D / 3D Results Visualizer require that OpenGL is installed on the computer and it is essential that computers that will be used for CoventorWare pre and post processing have a good graphics card with the most up to date drivers.

Graphics card information for SEMulator3D:

Support for OpenGL Minimum 64 MB dedicated memory, more is recommended Cards based on NVIDIA or ATI chip sets are recommended Up-to-date driver software At least one bit of alpha buffer (available on most newer cards)

For further information on the CoventorWare hardware requirements, please visit the Coventor web site:

• http://www.coventor.com/mems/support/sysreq.html

Training Courses

Coventor offers a number of training courses worldwide. Courses are divided into lectures and computer simulation work, with strong emphasis on hands-on lab exercises. Students will be able to interact with members of Coventor's technical staff, discuss their specific design problems and simulate devices of interest. The Coventor instructors are Ph.D.-level engineers with both academic and industrial expertise.

If you have any questions about the courses or if you wish to apply, please contact Coventor directly.

• www.coventor.com/mems/support/training.htm

Coventor Classroom Teaching Licenses

The Microelectronics Support Centre at RAL is pleased to offer Coventor Classroom Teaching Licenses to EUROPRACTICE members.

EUROPRACTICE Coventor Classroom Teaching licenses are intended for institutes to do mass class teaching of their students, in cases where they have too few regular EUROPRACTICE non-commercial research and training license seats for that purpose.  The Classroom Teaching licenses will be subject to all the usage restrictions of the regular EUROPRACTICE Coventor licenses.

Teaching licenses are available for the following products:

• Designer/Analyzer
• MEMS+ for Cadence
• MEMS+ for Matlab
• MEMS+ for Cadence & Matlab

Teaching licenses comprise 5 full licenses. Teaching licenses are purchased on a yearly basis, there is no annual maintenance. As part of the ordering procedure, universities must supply a syllabus and/or a weblink to the proposed training course.

The Coventor Classroom Teaching Licenses prices and software order forms can be accessed via the Europractice Members Only webpages

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Software Ordering

The EUROPRACTICE Software Service place bulk orders with Vendors monthly. In order to be included on the monthly order, Institute orders to EUROPRACTICE must be received at RAL by no later than the 25th day of each month.

Detailed instructions on how to place a EUROPRACTICE software order, how to complete the software order forms and the financial procedures that must be followed are given in the Software Order Procedures.

Useful documents:

• Software Order Procedures

• Coventor End User Agreement for Academic Institutions

• Software Versions and Operating Systems

Please access the Coventor software prices, maintenance prices and software order forms through the Europractice Members Only webpages

PLEASE ensure that you read the End User Agreement Notes before downloading the End User Agreements.

• Software price list
• Maintenance price list

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The EUROPRACTICE Software Service is managed by the Microelectronics Support Centre, Rutherford Appleton Laboratory, UK. You can contact the EUROPRACTICE Software Service by email: MicroelectronicsCentre@stfc.ac.uk Last modified: May 11, 2012.

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