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7 April 2012. EUROPRACTICE/Cadence users are invited to attend the EMEA region CDNLive! 2012 event in Munich, 14-16 May.
More details can be found at the CDNLive! webpages http://www.cadence.com/cdnlive/eu/2012/pages/default.aspx
Please note that academic users can obtain a discount when registering for the conference by using a promotional code that can be obtained from the Microelectronics Support Centre.
There will be a EUROPRACTICE presentation at 11.30 on Tuesday 15 May. Please come along to talk to our staff and find out what’s new in our Cadence offering.
3 April 2012. The Microelectronics Support Centre is very pleased to announce access to the Cadence Internet-Learning Series (iLS) for all EUROPRACTICE universities.
The iLS courses are self-paced, online training courses. Unlike the conventional instructor-led courses, each course can be undertaken at the end-user’s normal working location, over an extended period of time. The iLS courses include dynamic course content, downloadable labs, instructor notes, and bulletin boards.
Since these courses are not appropriate for direct training of students, the intention is that they are used to train selected staff in the institution, who would then pass on this knowledge.
The list of Cadence iLS courses available via Europractice can be found at the EUROPRACTICE/Cadence iLS booking portal. Please ask your EUROPRACTICE site representative to grant you access to this and enable bookings if you do not already have a password associated with your email address.
More information is available here
| The Transaction Level Modelling (TLM) Package consists of tools for high level design and verification of
digital systems. (This is a subset of the IC Package). |
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| The IC Package comprises a suite of advanced design and analysis tools for creating digital, analogue
and mixed-signal IC designs. | |
| The Combined IC & Systems Package comprises all of the tools in the IC Package, as well as all of the tools in the Systems Package. | |
| The Systems Package comprises tools for advanced PCB design and IC Packaging flows. | |
| The PCB Studio Package provides an alternative PCB design capability for Microsoft Windows users. |
Optional Packages
Licenses for options are generated on the same servers (with the same number of seats as the main package). It is not possible to give any separate licensing information.
System in Package (SiP) Option to Combined IC & Systems package
The SiP Option additionally provides Digital and RF SiP design capabilities, streamlining the integration of multiple chips (into a die stack or single substrate). It includes tools for; architecting SiP systems by capturing and exploring top-level SiP connectivity, IC/package IO planning and optimisation for 3D die stack creation, 3D die stack viewing, DRC, bondability verification, and cross-die RF SiP simulation.
Manufacturability Verification System (MVS) Option to IC or Combined IC & Systems package
The Manufacturability Verification System Option additionally includes tools for Full chip model based manufacturability checking, enabling users to easily identify sections of layout which will cause a loss in lithographic fidelity (affecting circuit behaviour and yield).
Virtual System Platform (VSP) Option to the IC or Combined IC & Systems package click here for a datasheet
The Virtual System Platform Option adds new functionality to Cadence’s Incisive suite of tools that allows the development of TLM Virtual Platforms. Virtual Platforms enable pre-RTL software development, functional verification, and system analysis and optimization before committing to hardware micro-architecture. VSP automates the process of creating a virtual prototype, debugging software with a virtual prototype, and deploying the virtual prototype to the software team.
Virtual Platforms can also be used after RTL/Silicon is available. The Virtual Platform allows greater visibility than a hardware prototype, allowing better debug and verification of internal blocks and signals, and offers much greater performance than RTL simulation, allowing interactive debugging of software applications running on the Virtual platform.
VSP relies on fast processor models, which provide the high-performance execution speed required for an effective software development solution. VSP supports ARM Fast Models and Imperas OVP fast processor models (ARM, ARC, MIPS, etc.), to provide hundreds of millions of software instructions per second execution and lock-step software and hardware debugging.
More information about Imperas models will follow.
Licenses for processor models are not included with VSP and must be obtained separately. For details please contact the Microelectronics Support Centre.
InCyte Chip Estimator (INCYTE) Option to the IC or Combined IC & Systems package
The InCyte Chip Estimator Option enables high level chip planning and detailed metrics estimation. It includes access to the chip estimator environment for chip architects to quickly obtain early estimates of chip design metrics, such as; performance, power consumption, area, and cost. Use of this software is controlled by login accounts/passwords for the Chip Estimate portal (where the necessary information to form the estimates is stored), rather than by conventional licenses. Institutions ordering this package will receive login accounts/passwords for 5 named institution users.
Please click on the images below for 3 short videos showing the Cadence InCyte Chip Estimator software in action. Click icon in bottom right corner of image to view in full screen mode.
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Loading the player for InCyte video 1 ... Manual video download |
Loading the player for InCyte video 2 ... Manual video download |
Loading the player for InCyte video 3 ... Manual video download |
Please refer to the lists below for full details of the latest releases.
The EUROPRACTICE Software Service place bulk orders with Vendors monthly. In order to be included on the monthly order, Institute orders to EUROPRACTICE must be received at RAL by no later than the 25th day of each month.
Detailed instructions on how to place a EUROPRACTICE software order, how to complete the software order forms and the financial procedures that must be followed are given in the Software Order Procedures.
Useful documents:
PLEASE note EUROPRACTICE members wishing to purchase Cadence for the first time must complete the Cadence End User Agreement AND the Cadence Export Classification document. The completed and signed documents must accompany your initial Cadence software order only. They are not needed when ordering additional Cadence licenses. Two copies of the End User Agreement must be completed and each must contain an original signature in ink on both pack pages.
PLEASE ensure that you read the End User Agreement Notes before downloading the End User Agreements.
EUROPRACTICE member organisations wishing to gain access to the Cadence Online Support Knowledge Base will also need to complete two copies of an Amendment to their End User Agreement.
PLEASE read the Notes on Cadence EUA Amendment for Online Support Knowledge Base Access before downloading.
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The EUROPRACTICE Software Service is managed by the Microelectronics Support Centre, Rutherford Appleton Laboratory, UK.
You can contact the EUROPRACTICE Software Service by email: MicroelectronicsCentre@stfc.ac.uk Last modified: May 14, 2012 |