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|ANSYS HFSS Bundle||ANSYS RedHawk & PowerArtist Bundle||How to Order|
ANSYS HFSS Bundle
ANSYS HFSS Bundle includes 3-D full wave electromagnetic field (frequency and time domain), power and signal integrity, 3-D and 2-D parasitic extraction tools & solvers; high performance shared & distributed memory (HPC) solvers; plus EDA/ECAD import tools. Collectively this bundle of simulation technology provides industry leading tools for high-performance RF, microwave, antenna, millimeter-wave device simulation and signal and power integrity (SI/PI) digital and mixed signal applications.
|ANSYS HFSS Bundle Product List|
|ANSYS HFSS||Accurate simulation of 3-D full-wave electromagnetic fields. HFSS offers multile solver technologies based on finite element, integral equation or advanced hybrid methods to solve a wide range of microwave, RF and high-speed digital applications|
|ANSYS Q3D Extractor||3-D and 2-D parasitic extraction tool for engineers designing electronic packaging and power electronic equipment. Q3D Extractor uses method of moments (integral equations) and FEMs to compute capacitive, conductance, inductance and resistance matrices. It uses the fast multipole method (FMM) to accelerate the solution of the integral equations. Outputs from the solver include current and voltage distributions, CG and RL matrices.|
|ANSYS SI Wave (including SI and RF options)||Power integrity, signal integrity and EMI analysis of electronic packages and PCBs.provides a fast and accurate means to analyse the signal and power integrity of an entire PCB, taking into account coupling effects between traces, packages, and multiple boards, from DC up to frequencies beyond 50 GHz|
|ANSYS Optimetrics||Parametric optimization and sensitivity analysis capabilities to HFSS|
|EDA/ECAD geometry interfaces||Provide the capability to directly read-in IC and PCB designs in Cadence Allegro, Virtuoso, and Mentor Graphics Expedition file formats into HFSS, as well a mechanism to run the simulator from within these EDA tools|
|ANSYS Academic Research High Performance Computing (HPC)||For most ANSYS physics solvers this is both shared & distributed memory HPC capability for up to four cores per HFSS license.|
ANSYS HFSS Bundle Licenses
ANSYS HFSS Bundle is available to Europractice members in bundles of 25 licenses. Depending on need, multiple bundles may be licensed by each Europractice member up to a maximum of 10 bundles (250 licenses). Each block of 25 HFSS Single processor/core licenses includes an additional 100 multi-processor/multi-core HFSS analysis licenses (also known as HFSSHPC licenses). This enables greater flexibility for your HFSS users and means that (for each block of 25 licenses) you have 25 HFSS single processor/core licenses enabling 25 HFSS user sessions, and furthermore each of these can additionally access up to 4 multi-processor/multi-core HFSS analysis licenses. Alternatively if you only have 1 HFSS user session active, this session can access up to 100 multi-processor/multi-core HFSS analysis licenses for distributed analysis using multiple cores and/or multiple processors. i.e. per block of licenses you can have 25 HFSS simultaneous user sessions and up to 100 multi-processor/multi-core distributed between these sessions at run time.
ANSYS HFSS Bundle is licensed by a run-time license mechanism based on FLEXnet(FLEXlm) software license manager, with the license server hosted by Europractice at STFC Rutherford Appleton Laboratory. Authorised users of ANSYS HFSS Bundle within Europractice members will have a local installation of the ANSYS HFSS Bundle software tools but the license server will be provided and maintained by Europractice with users obtaining licenses at run-time across the network from the Europractice ANSYS License server using the port@host mechanism. Consequently, Europractice members will require a continuous network connection to the license server in order to run ANSYS HFSS Bundle tools. Local license servers based within Europractice member institutions are not available for ANSYS HFSS Bundle.
ANSYS RedHawk & PowerArtist Bundle
Ansys Redhawk & Powerartist bundle includes tools for RTL power signoff (Powerartist XP) and for Full-chip IC power signoff (Redhawk NX)
Redhawk NX provides advanced power signoff and power rail signoff (power integrity analysis) for full-chip IC designs, enabling designers to analyse the power and ground rails in IC designs for IR-drop (voltage changes) and electro-migration (EM). Redhawk NX supports both static and dynamic power analysis (with both vector and vectorless analysis flows).
Powerartist XP is a complete RTL low power analysis platform, which enables early analysis of the power consumption of your RTL design (targeting a particular process technology and libraries). It enables designers to explore techniques for power reduction, including; clock gating, multi-Vt optimization, power gating, and multi-voltage design. It also enables designers to explore differing RTL power reduction techniques, with suggested power reduction techniques being proposed.
|ANSYS HFSS PowerArtist & RedHawk List|
ANSYS PowerArtist & RedHawk Bundle Licenses
ANSYS RedHawk & PowerArtist Bundle is available to Europractice members in bundles of 25 licenses. Depending on need, multiple bundles may be licensed by each Europractice member up to a maximum of 10 bundles (250 licenses).
ANSYS RedHawk & PowerArtist Bundle is licensed by a run-time license mechanism based on FLEXnet(FLEXlm) software license manager, with the license server hosted by Europractice at STFC Rutherford Appleton Laboratory. Authorised users of ANSYS RedHawk & PowerArtist Bundle within Europractice members will have a local installation of the ANSYS RedHawk & PowerArtist Bundle software tools but the license server will be provided and maintained by Europractice with users obtaining licenses at run-time across the network from the Europractice ANSYS License server using the port@host mechanism. Consequently, Europractice members will require a continuous network connection to the license server in order to run ANSYS RedHawk & PowerArtist Bundle tools. Local license servers based within Europractice member institutions are not available for RedHawk.
How to Order
Orders are placed with the vendor on a single order, once per month. To be included in the current month's order, all documents including original ink-signed paper End User Agreements (if applicable) must be received by the Microelectronics Support Centre no later than the 25th day of the month.
Detailed instructions on how to place an order are given in our Order Procedures.
MANDATORY DOCUMENTS FOR ALL ORDERS
- ANSYS Order Form 1 copy, electronic copy via e-mail accepted, and
- Purchase Order 1 copy, electronic copy via e-mail accepted, and
- Brief statement on letterhead paper to justify number of licenses being requested (see Note 1 on Order Form), 1 copy, electronic copy via e-mail accepted
MANDATORY DOCUMENTS FOR FIRST TIME ORDER FROM THIS VENDOR ONLY
- ANSYS End User Agreement for Academic Institutes and Research Laboratories TWO copies each with signatures in ink, electronic copies NOT accepted, paper originals must be sent to the Microelectronics Support Centre via courier recommended, see Order form for address
STATEMENT FROM RESEARCH LABORATORIES
- End Usage Statement for Vendor Approval required when ordering first licenses of anynew license bundle, 1 copy, electronic copy via e-mail accepted, can be sent in advance of other paperwork
PLEASE ENSURE that you read the End User Agreement Notes before downloading the End User Agreements
|Europractice membership and design tools access is managed by STFC at the Microelectronics Support Centre, Rutherford Appleton Laboratory, UK. You can contact the Microelectronics Support Centre by email:
Last modified: September 18, 2017